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SK Hynix said on April 22, 2026 it will invest 19 trillion won (about $12.85 billion) to build a new advanced packaging manufacturing plant in South Korea, with construction starting this month.
The facility will be dedicated to advanced packaging processes used to produce AI-focused memory products such as high-bandwidth memory (HBM) chips, responding to surging demand from data centres and AI infrastructure customers including Nvidia.
The announcement follows the companyâs accelerated capacity expansion this year and comes as SK Hynix approaches an expected record first-quarter performance; analysts and market trackers forecast sharply higher revenue and operating profits and the companyâs shares have run up strongly, helping push the KOSPI to record levels.
The investment underscores SK Hynixâs push to scale production of AI memory components and to secure supply for global cloud and AI service providers.
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đ°ď¸ The Story So Far: An Evolving Timeline
Thursday, April 23, 2026 01:33 UTC
SK Hynix posts record profit as AI memory demand surges
Wednesday, April 22, 2026 12:54 UTC
SK Hynix to Invest $12.85 Billion in Advanced Packaging Plant







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